Solvent systems for metals and inks

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United States of America Patent

PATENT NO 8597548
APP PUB NO 20080145560A1
SERIAL NO

11857818

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Abstract

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Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.

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Patent Owner(s)

Patent OwnerAddress
CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Desai, Nitin Princeton Junction, US 73 4772
Khaselev, Oscar Monmouth Junction, US 35 189
Marczi, Michael T Chester, US 22 170
Singh, Bawa Voorhees, US 108 1502

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