Scanner performance comparison and matching using design and defect data
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United States of America Patent
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Nov 26, 2013
Grant Date -
Jul 14, 2011
app pub date -
Jul 12, 2010
filing date -
Jul 17, 2009
priority date (Note) -
In Force
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Abstract
A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KLA-TENCOR CORPORATION | ONE TECHNOLOGY DRIVE MILPITAS CA 95035 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Aoki, Masami | Kanagawa, JP | 37 | 937 |
Chang, Ellis | Saratoga, US | 32 | 1401 |
Park, Allen | San Jose, US | 40 | 1165 |
Plihal, Martin | Pleasanton, US | 45 | 445 |
Van, Riet Michael John | Sunnyvale, US | 1 | 22 |
Young, Chris Chih-Chien | Palo Alto, US | 1 | 15 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 26, 2025 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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