On-die bond wires system and method for enhancing routability of a redistribution layer
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United States of America Patent
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Nov 26, 2013
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N/A
app pub date -
Dec 12, 2011
filing date -
Mar 27, 2006
priority date (Note) -
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Abstract
An integrated circuit includes a first die and a second die positioned in a package. The first die has a redistribution layer formed on the die and including a plurality of relocated bond pads. The relocated bond pads are positioned near an inner edge of the first die that is adjacent to an inner edge of the second die. Each relocated bond pad is coupled to a corresponding bond pad on the second die through a respective bonding wire. The first die further includes a plurality of original bond pads. The redistribution layer further includes at least one intermediate bond pad electrically interconnected through a respective conductive trace to a corresponding original bond pad. Each intermediate bond pad is electrically connected to a corresponding relocated bond pad through a respective bond wire.
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