Method of bonding semiconductor substrate and MEMS device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 26, 2013
Issued Date -
N/A
app pub date -
Dec 11, 2009
filing date -
Dec 11, 2009
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
A method of bonding a semiconductor substrate has a step of pressurizing and heating to bond a substrate 11 with a substrate 12 by eutectic bonding in a state that an aluminum containing layer 31 and a germanium layer 32 between a bonding section 30a of the substrate 11 and a bonding section 30b of the substrate 21 are overlaid and an outer end 32a of the germanium layer 32 is receded inward with respect to an outer end 31a of the aluminum containing layer 31.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PIONEER CORPORATION | TOKYO 113-0021 | |
PIONEER MICRO TECHNOLOGY CORPORATION | NO 465 OHSATO-CHO KOUFU-SHI YAMANASHI |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ishimori, Masahiro | Yamanashi, JP | 18 | 179 |
# of filed Patents : 18 Total Citations : 179 | |||
Noda, Naoki | Yamanashi, JP | 11 | 378 |
# of filed Patents : 11 Total Citations : 378 | |||
Yokouchi, Toshio | Yamanashi, JP | 4 | 26 |
# of filed Patents : 4 Total Citations : 26 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 4.91 % this patent is cited more than
- 12 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 26, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Sep 03, 2018 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
Sep 03, 2018 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Jul 27, 2018 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Jul 27, 2018 |
Mar 12, 2018 | FEPP | FEE PAYMENT PROCEDURE | free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.) |
Jan 24, 2014 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Dec 01, 2013 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAT HOLDER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: LTOS); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
Feb 15, 2011 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SIEGEL AERODYNAMICS, INC.;REEL/FRAME:025856/0608 Owner name: ATARGIS ENERGY CORPORATION, COLORADO Effective Date: Feb 15, 2011 |
Jul 27, 2010 | I | Issuance | |
Sep 20, 2007 | P | Published | |
Mar 14, 2006 | F | Filing | |
Mar 14, 2006 | PD | Priority Date | |
Mar 13, 2006 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SIEGEL, STEFAN GUNTHER;REEL/FRAME:017694/0250 Owner name: SIEGEL AERODYNAMICS, INC., COLORADO Effective Date: Mar 13, 2006 |

Matter Detail

Renewals Detail
