Cooling arrangement for an optical pick-up
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United States of America Patent
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Nov 19, 2013
Grant Date -
Jun 1, 2006
app pub date -
Jul 29, 2005
filing date -
Nov 30, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a reliable optical pick-up which can prevent deterioration of a performance of a component, shortening of a service life or malfunctioning due to heat generation of an laser driver IC, wherein a metallic pattern is provided on a flexible printed board, having an area wider than the external shape of the laser driver IC and having an exposed outer surface, and made of the same material as that of a wiring pattern. It is preferable to bend the flexible printed board in a mounting part for the laser driver IC so that the metallic pattern is faced to and superposed with a surface of the flexible printed board on the side remote from the surface on which the laser driver IC is mounted.
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