Wafer lens and method for the production thereof

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United States of America Patent

PATENT NO 8587871
APP PUB NO 20120268829A1
SERIAL NO

13365915

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Abstract

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Disclosed is a wafer lens in which the warpage of a glass substrate included therein can be prevented. Specifically disclosed is a wafer lens comprising a glass substrate, a first resin part composed of a curable resin, and a second resin part composed of a curable resin. In each of the first resin part and the second resin part, two or more lens parts are formed. The volume of the resin of the first resin part after the cutting and the volume of the resin of the second resin part after the cutting satisfy the condition 0.6≦Vwa/Vwb≦2.1, wherein “Vwa” indicates a volume of a resin on an object side and “Vwb” indicates a volume of a resin on an image side.

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Patent Owner(s)

Patent OwnerAddress
KONICA MINOLTA OPTO INCTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuta, Yasunari Osaka, JP 25 299

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