Through silicon via dies and packages
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United States of America Patent
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Nov 19, 2013
Issued Date -
N/A
app pub date -
Jun 5, 2008
filing date -
Jun 7, 2007
priority date (Note) -
Expired
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Abstract
A method for preparing a die for packaging is disclosed. A die having first and second major surfaces is provided. Vias and a mask layer are formed on the first major surface of the die. The mask includes mask openings that expose the vias. The mask openings are filled with a conductive material. The method includes reflowing to at least partially fill the vias and contact openings to form via contacts in the vias and surface contacts in the mask openings.
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