Electronic component repair method
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United States of America Patent
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Nov 19, 2013
Grant Date -
Feb 9, 2012
app pub date -
Aug 2, 2011
filing date -
Aug 6, 2010
priority date (Note) -
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Abstract
An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.
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