Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8580656
APP PUB NO 20100009517A1
SERIAL NO

12499556

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
VERSUM MATERIALS US LLC8555 S RIVER PARKWAY TEMPE AS 85284

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Collier, Terence Quintin Rowlett, US 5 17
Lhota, Charles A San Antonio, US 1 5
Ramamurthi, Rajkumar Cave Creek, US 3 14
Rao, Madhukar Bhaskara Fogelsville, US 34 529
Rennie, David Barry Bethlehem, US 7 144
Tamboli, Dnyanesh Chandrakant Breinigsville, US 23 184

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 12, 2025
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00