Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
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United States of America Patent
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Nov 12, 2013
Grant Date -
Jan 14, 2010
app pub date -
Jul 8, 2009
filing date -
Jul 14, 2008
priority date (Note) -
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Abstract
Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
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