Embossed durable supports with RFID chip, for labeling and relabeling objects
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United States of America Patent
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Nov 12, 2013
Grant Date -
N/A
app pub date -
Dec 21, 2010
filing date -
Dec 19, 2006
priority date (Note) -
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Abstract
A self adhesive embossed support comprising:
- (a) a resin film which may be a thermoplastic or a thermoset resin having at least one embossed surface for receiving a removable element where the embossed surface has a reduced surface area of contact that allows for removal of an adhesive backed element without leaving any substantial adhesive residue; and an adhesive side on the side of the resin film opposite the receiving side with the embossed surface with an adhesive having an ultimate release energy level greater than the attraction forces between the embossed film and a substrate to be removed;(b) the substrate receiving side consisting of a reduced surface area surface to facilitate release of the applied element without making use of a coated release substance or film made with materials that have inherent release characteristics that are adapted to support a removable element attachable thereto by means comprising attraction forces between the resin film and the substrate.
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