Semiconductor element mounting member, method of producing the same, and semiconductor device
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United States of America Patent
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Nov 5, 2013
Grant Date -
Nov 22, 2012
app pub date -
Aug 1, 2012
filing date -
Feb 8, 2010
priority date (Note) -
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Abstract
A semiconductor element mounting member is arranged to infiltrate a matrix metal into a porous body that is formed by sintering diamond particles being in direct contact with each other and that has an infiltration auxiliary layer selectively formed only on the exposed surface of each diamond particle. A production method includes a step at which a mixture of diamond particles, a powder of a chemical element out of which the infiltration auxiliary layer is made, and an ammonium chloride powder is compressed and molded, is then heated to 900° C. or more, and is formed into the porous body. A semiconductor device has a semiconductor element mounted on an element mounting surface of the semiconductor element mounting member with a connecting layer therebetween.
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