Electroplating method for coating a substrate surface with a metal
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United States of America Patent
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Nov 5, 2013
Grant Date -
Feb 18, 2010
app pub date -
Sep 20, 2006
filing date -
Sep 20, 2005
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Abstract
The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.
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