Method and apparatus for mounting distributed buoyancy modules on a rigid pipeline

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United States of America Patent

PATENT NO 8573888
APP PUB NO 20090313794A1
SERIAL NO

12306998

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Abstract

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An apparatus and method for mounting a buoyancy module onto a rigid pipe having a clamp. In one embodiment the clamp includes pads for clamping onto the outer surface or coating of the rigid pip, the pads having a teeth or serrations formed thereon for gripping the outer surface of the pipe. In a second embodiment, the clamp includes one or more coil springs formed from a resilient material adapted to be wound around the outer circumference of the pipe. The method for mounting a buoyancy module onto a rigid pipe includes the steps of reducing the outer diameter of the pipe at a location of the pipe to which a buoyancy module is to be attached and subsequently mounting a buoyancy module at such location.

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Patent Owner(s)

Patent OwnerAddress
TECHNIP FRANCE SA92400 COURBEVOIE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Denniel, Sylvain Aberdeen, GB 7 69
Ross, Richard Alan Leslie Aberdeen, GB 1 4

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