Method for dispensing solder on a substrate and method for mounting semiconductor chips
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United States of America Patent
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Nov 5, 2013
Grant Date -
Nov 29, 2012
app pub date -
May 17, 2012
filing date -
May 23, 2011
priority date (Note) -
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Abstract
The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.
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