Heat sink assembly and light
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United States of America Patent
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Oct 29, 2013
Grant Date -
Sep 19, 2013
app pub date -
Mar 16, 2012
filing date -
Mar 16, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A heat sink for a light emitting diode (LED) lamp assembly includes a core region having a lower end, an upper end, a first region configured to receive an electrical connector, a second region configured to receive at least one LED, and a plurality of longitudinal vanes extending outwardly from the core region, and an upper thermal ring intersecting with and supported by the vanes. The heat sink further includes webs formed between adjacent pairs of the longitudinal vanes, the webs collectively defining an auxiliary thermal ring, the auxiliary thermal ring substantially circumferentially surrounding in spaced relation the core region and disposed, as viewed in the longitudinal direction, between the upper thermal ring and the lower rim. Each of the longitudinal vanes defines a respective thermal notch formed on a vane surface facing an adjacent longitudinal vane, the thermal notch being in confronting relationship to a respective air low aperture.
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