Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
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United States of America Patent
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Oct 22, 2013
Grant Date -
Aug 2, 2012
app pub date -
Apr 9, 2012
filing date -
Mar 31, 2010
priority date (Note) -
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Abstract
The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.
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