Wafer fabrication process
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United States of America Patent
Stats
-
Oct 22, 2013
Grant Date -
Sep 13, 2012
app pub date -
May 20, 2012
filing date -
Aug 9, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.
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Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- B08B Class
- 8.06 % this patent is cited more than
- 12 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 22, 2025 |
