Fungal modified chitosan adhesives and wood composites made from the adhesives
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United States of America Patent
Stats
-
Oct 22, 2013
Grant Date -
Aug 4, 2011
app pub date -
Jan 21, 2011
filing date -
Feb 1, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention describes a fungal modified chitosan adhesive for binding a fibrous material and the method of producing the adhesive. The adhesive is produced by providing a chitosan containing raw material; a fungal growing medium; a fungal culture; mixing the raw material, the growing medium and the fungal culture together to produce a suspension; incubating the suspension to produce a broth comprising a modified chitosan solid, an at least partially-consumed medium liquid and a fungal residue; separating the modified chitosan solid from the liquid and the fungal residue, and dissolving the modified chitosan solid to produce the adhesive resin.
First Claim
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Family
International Classification(s)
- 2011 Application Filing Year
- C09J Class
- 620 Applications Filed
- 411 Patents Issued To-Date
- 66.30 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 22, 2025 |
