Abrasive compact
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United States of America Patent
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Oct 22, 2013
Grant Date -
Dec 9, 2010
app pub date -
Jul 23, 2008
filing date -
Jul 23, 2007
priority date (Note) -
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Abstract
The invention relates to an abrasive compact comprising a mass of diamond particles and a silicon containing binder phase wherein the diamond particles are present in an amount less than 75 volume % and the binder phase contains less than 2 volume % unreacted (elemental) silicon. The invention further relates to a method of producing an abrasive compact including the steps of forming a feed diamond powder into a diamond preform, interposing a separating mechanism between the diamond preform and a silicon infiltrant source, heating the diamond preform and silicon infiltrant source until the infiltrant is molten and the preform and infiltrant are isothermal and allowing infiltration from the molten silicon infiltrant source to occur into the diamond preform.
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