Electronic package with thermal interposer and method of making same
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United States of America Patent
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Oct 15, 2013
Grant Date -
Aug 9, 2012
app pub date -
Feb 8, 2011
filing date -
Feb 8, 2011
priority date (Note) -
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Abstract
An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package.
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