Semiconductor device having gate insulating film including high dielectric material

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United States of America Patent

PATENT NO 8558321
APP PUB NO 20110169100A1
SERIAL NO

13005085

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Abstract

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A semiconductor device includes: a first MIS transistor of a first conductivity type having a first active region as a region of a semiconductor substrate surrounded by an element isolation region formed in an upper portion of the semiconductor substrate, a first gate insulating film having a first high dielectric film formed on the first active region, and a first gate electrode formed on the first gate insulating film; and a resistance element having a second high dielectric film formed on the element isolation region and a resistance layer made of silicon formed on the second high dielectric film. The first high dielectric film and the second high dielectric film include the same high dielectric material, and the first high dielectric film includes a first adjustment metal, but the second high dielectric film does not include the first adjustment metal.

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Patent Owner(s)

Patent OwnerAddress
PANNOVA SEMIC LLC3945 FREEDOM CIRCLE SUITE 900 SANTA CLARA CA 95054

International Classification(s)

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  • 2011 Application Filing Year
  • H01L Class
  • 19146 Applications Filed
  • 15997 Patents Issued To-Date
  • 83.56 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20112012201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Hideyuki Toyama, JP 73 1307
Oosuka, Tsutomu Toyama, JP 9 59
Sato, Yoshihiro Toyama, JP 268 1656
Shimizu, Hiroji Toyama, JP 19 60
Yamada, Takayuki Toyama, JP 284 2581

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4074140169277539225214911984534318001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0250500750100012501500175020002250250027503000325035003750400042504500

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