Method of inspecting pattern and inspecting instrument
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United States of America Patent
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Oct 15, 2013
Grant Date -
Feb 1, 2007
app pub date -
Sep 12, 2006
filing date -
Dec 2, 1999
priority date (Note) -
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Abstract
An electron beam apparatus equipped with a review function of a semiconductor wafer includes a scanning electron microscope to obtain image information of a semiconductor wafer, and an information processing apparatus to process the image information. The information processing apparatus includes a data input unit to receive positional information of a defect on the wafer, a storage for storing a plurality of image information of a position on the wafer corresponding to the positional information, and an image processing unit that retrieves any of the plurality of image information, and classifies the retrieved image information corresponding to the positional information depending on the type of defect.
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