Printhead assembly with multiple printhead modules and printed circuit boards in single casing
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United States of America Patent
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Oct 15, 2013
Grant Date -
Sep 9, 2010
app pub date -
May 19, 2010
filing date -
Dec 6, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A printhead assembly that has a casing with a series of module mounting sites, printed circuit board mounting sites and busbar support formations. A printhead module is mounted to each module mounting site respectively. Each printhead module has a printhead integrated circuit (IC). A plurality of printed circuit boards control the printhead IC's, one of the printed circuit boards being fixed to each of the printed circuit board mounting sites respectively. Busbars are secured in the busbar support formations for receiving data and power from the printed circuit boards. The printhead modules are electrically connected to the busbars to provide the printhead integrated circuits with power and data.
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