Methods of attaching a die to a substrate
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United States of America Patent
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Oct 15, 2013
Grant Date -
Jan 29, 2009
app pub date -
Jul 17, 2008
filing date -
Jul 19, 2007
priority date (Note) -
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Abstract
Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.
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