LED package structure with a fuse for protection from high current

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United States of America Patent

PATENT NO 8552450
APP PUB NO 20110278639A1
SERIAL NO

13192988

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Abstract

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An LED package structure comprises an LED chip and a fuse electrically connected to the LED chip in series. The fuse has a low melting point such that the fuse melts under a high current to form an open circuit to prevent the high current from flowing through the LED chip.

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Patent Owner(s)

Patent OwnerAddress
EVERLIGHT ELECTRONICS CO LTDNO 6-8 ZHONGHUA RD SHULIN DIST NEW TAIPEI CITY 23860

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Weng, Ssu-Yuan New Taipei, TW 5 10

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