Alkali developable photosensitive resin composition and dry film manufactured by the same
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United States of America Patent
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Oct 8, 2013
Grant Date -
May 6, 2010
app pub date -
Aug 20, 2008
filing date -
Aug 20, 2007
priority date (Note) -
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Abstract
The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.
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