Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package
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United States of America Patent
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Oct 8, 2013
Issued Date -
N/A
app pub date -
Feb 19, 2008
filing date -
Feb 26, 2007
priority date (Note) -
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Abstract
Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap (10) is used for an electronic component storing package (100) which includes an electronic component storing member (20) for storing an electronic component (40). The airtightly sealing cap is provided with a base material (1); a base layer (2) which is formed on the surface of the base material and contains Ni; and a soldering material layer (6), which is formed on the base layer, has a thickness of 10 μm or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.
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