Semiconductor structure and method for manufacturing the same

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United States of America Patent

PATENT NO 8546910
APP PUB NO 20120319181A1
SERIAL NO

13380723

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Abstract

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The present invention provides a semiconductor structure, which comprises a substrate, a semiconductor base, a cavity, a gate stack, sidewall spacers, source/drain regions and a contact layer; wherein, the gate stack is located on the semiconductor base, the sidewall spacers are located on sidewalls of the gate stack, the source/drain regions are embedded within the semiconductor base and located on both sides of the gate stack, the cavity is embedded within the substrate, and the semiconductor base is suspended over the cavity, the thickness in the middle portion of the semiconductor base is greater than the thicknesses at both ends of the semiconductor base in a direction along the gate length, and both ends of the semiconductor base are connected with the substrate in a direction along the gate width; the contact layer covers exposed surfaces of the source/drain regions. Accordingly, the present invention further provides a method for manufacturing a semiconductor structure, which is favorable for reducing the contact resistance at the source/drain regions, enhancing the device performance, lowering the cost and simplifying the manufacturing process.

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Patent Owner(s)

Patent OwnerAddress
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD100176 8 WENCHANG AVENUE BEIJING ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE BEIJING BEIJING CITY BEIJING CITY 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Luo, Zhijiong Poughkeepsie, US 255 4762
Yin, Haizhou Poughkeepsie, US 244 3095
Zhu, Huilong Poughkeepsie, US 705 13304

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