Bonding apparatus and method
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United States of America Patent
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Oct 1, 2013
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N/A
app pub date -
Mar 20, 2012
filing date -
Dec 15, 2008
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Abstract
A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
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