Through-substrate via having a strip-shaped through-hole signal conductor
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United States of America Patent
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Sep 24, 2013
Grant Date -
Jan 10, 2013
app pub date -
Jun 28, 2012
filing date -
Jul 6, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A TSV structure suitable for high speed signal transmission includes a metal strip portion that extends through a long and small diameter hole in a substrate. In one example, the metal strip portion is formed by laser ablating away portions of a metal sheath that lines a cylindrical sidewall of the hole, thereby leaving a longitudinal section of metal that is the metal strip portion. A second metal strip portion, that extends in a direction perpendicular to the hole axis, is contiguous with the metal strip portion that extends through the hole such that the two metal strip portions together form a single metal strip. Throughout its length, the single metal strip has a uniform width and thickness and therefore can have a controlled and uniform impedance. In some embodiments, multiple metal strips pass through the same TSV hole. In some embodiments, the structure is a coaxial TSV.
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