Transparent substrates with dielectric layer having a marking below the surface of the transparent substrate
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United States of America Patent
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Sep 24, 2013
Grant Date -
Mar 15, 2007
app pub date -
Aug 18, 2006
filing date -
Aug 18, 2005
priority date (Note) -
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Abstract
This invention concerns a method of producing subsurface marking in a transparent body. According to the invention, the marking is done less than 500 μm below the surface by applying a layer system with a high destruction threshold, compared to the substrate, to the surface of the substrate. If the layer system is designed as an anti-reflection coating system for the reading wavelength, it increases the contrast for reading. If the layer system is designed as a mirror for the writing wavelength, the writing can be done in reflection at a lower intensity.
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