Coreless layer buildup structure with LGA
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United States of America Patent
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Sep 17, 2013
Grant Date -
Jun 28, 2012
app pub date -
Apr 22, 2010
filing date -
Apr 22, 2010
priority date (Note) -
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Abstract
A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
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