Resin composition for seamless air bag covers, and seamless air bag covers or seamless instrument panels with air bag covers, made by using the composition
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United States of America Patent
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Sep 17, 2013
Grant Date -
Jun 9, 2011
app pub date -
Feb 15, 2011
filing date -
Oct 15, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A resin composition for a seamless air bag cover or a resin composition for a seamless instrument panel having an air bag cover which comprises (A) 50 to 90% by mass of polypropylene, (B) 0 to 20% by mass of a thermoplastic elastomer and (C) 10 to 30% by mass of talc having an average particle diameter of 15 to 25 μm and a distribution of a particle diameter such that the content of particles having a diameter of 5 μm or smaller is 10% by mass or smaller and the content of particles having a diameter exceeding 40 μm is 10% by mass or smaller. The resin composition exhibits sufficient properties when an instrument panel is molded. A seamless instrument panel having an air bag cover can be obtained as an integrally molded product, which can be treated as a single article in recycling.
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 17, 2025 |
