Heat pipe and method for manufacturing same
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United States of America Patent
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Sep 17, 2013
Grant Date -
Mar 15, 2007
app pub date -
Jan 31, 2006
filing date -
Sep 1, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A thin and flat type heat pipe with enhanced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with the rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so that a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.
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