Diamond particle mololayer heat spreaders and associated methods
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United States of America Patent
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Sep 10, 2013
Grant Date -
Sep 27, 2012
app pub date -
Sep 21, 2011
filing date -
Sep 21, 2010
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Abstract
Thermally regulated semiconductor devices having reduced thermally induced defects are provided, including associated methods. Such a device can include a heat spreader having a monolayer of diamond particles within a thin metal matrix and a semiconductor material thermally coupled to the heat spreader. In one aspect, the coefficient of thermal expansion difference between the heat spreader and the semiconductor material is less than or equal to about 50%.
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