Polyimides and fluoropolymer bonding layer with improved internal adhesive strength
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United States of America Patent
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Sep 10, 2013
Grant Date -
Nov 11, 2010
app pub date -
Dec 22, 2008
filing date -
Dec 28, 2007
priority date (Note) -
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Abstract
Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent heat seal strength and superior internal adhesion strength comprise a base layer of polyimide having first and second major surfaces and a first fluoropolymer layer. The first fluoropolymer layer may be on the first major surface of the polyimide layer. Alternatively, it may be separated from the first major surface of the polyimide layer by an intervening layer. The first fluoropolymer layer comprises from about 70 to about 98% by weight of fluoroethylene propylene polymer (‘FEP’) and from about 30 to about 2% by weight of polytetrafluoroethylene polymer (‘PTFE’) or poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (‘PFA’) based on the total weight of the first fluoropolymer layer. Structures having fluoropolymer layers on both surfaces of the polyimide layer are also provided. Protected wire or cable using the composite, and methods are also described.

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- 15 United States
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- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KANEKA NORTH AMERICA LLC | 6161 UNDERWOOD ROAD PASADENA TX 77507 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Clements, Gregory Douglas | Houston, US | 3 | 30 |
Lee, Grant Richard | Deer Park, US | 2 | 28 |
Zheng, Haibin | Pearland, US | 50 | 703 |
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