Method and structure for forming a gyroscope and accelerometer
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United States of America Patent
Stats
-
Sep 10, 2013
Grant Date -
Sep 13, 2012
app pub date -
May 24, 2012
filing date -
Jan 3, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.
First Claim
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Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 4.91 % this patent is cited more than
- 12 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 10, 2025 |
