Heat-dissipating device having air-guiding cover
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United States of America Patent
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Sep 10, 2013
Grant Date -
Jun 18, 2009
app pub date -
Dec 12, 2007
filing date -
Dec 12, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins. Thus, the cooling airflow blows to the hottest portion of the heat-dissipating fins directly, thereby improving the cooling efficiency and lowering the temperature of the integrated circuit.
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