Method for manufacturing a three dimensional circuit board
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United States of America Patent
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Sep 10, 2013
Grant Date -
Aug 30, 2007
app pub date -
Feb 17, 2005
filing date -
Mar 4, 2004
priority date (Note) -
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Abstract
A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board, prescribed circuit patterns made of a conductive material are formed, and on the rear plane, prescribed circuit patterns are also formed. On the circuit board, a through hole is formed to carry electricity between the circuit patterns on both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns and wide in a circuit extending direction.
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