Method of sensing defects in the application of hot melt adhesive
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United States of America Patent
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Aug 27, 2013
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app pub date -
Apr 29, 2010
filing date -
Apr 29, 2010
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Abstract
A method of sensing defects in the application of hot melt adhesive to a structure. An infrared sensor is used to capture an infrared image of at least the location of the structure where the adhesive is supposed to have been applied. Different areas of the image are separately interrogated by reviewing each area to detect the presence or absence of adhesive. The interrogation is used to determine whether or not the application of the adhesive is of acceptable quality.
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