System and method for in situ monitoring of top wafer thickness in a stack of wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8520222
APP PUB NO 20130114090A1
SERIAL NO

13291800

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Abstract

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A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.

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Patent Owner(s)

Patent OwnerAddress
REVASUM INC825 BUCKLEY ROAD SAN LUIS OBISPO CA 93401

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schraub, Frederic Anthony San Luis Obispo, US 1 6
Smedley, Benjamin C San Luis Obispo, US 3 41
Vogtmann, Michael R San Luis Obispo, US 11 113

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