Method to form a device by constructing a support element on a thin semiconductor lamina
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United States of America Patent
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Aug 27, 2013
Grant Date -
Aug 30, 2012
app pub date -
Apr 18, 2012
filing date -
Dec 29, 2010
priority date (Note) -
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Abstract
A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved.
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