Lead-free, high-strength, high-lubricity copper alloys
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United States of America Patent
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Aug 27, 2013
Grant Date -
Dec 15, 2011
app pub date -
Mar 2, 2010
filing date -
Mar 3, 2009
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Abstract
A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.
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