Device and method for purifying a process gas in a reflow soldering system
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United States of America Patent
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Aug 27, 2013
Grant Date -
Nov 13, 2008
app pub date -
Feb 20, 2006
filing date -
Mar 7, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.
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