Method of electrically connecting a microelectronic component
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United States of America Patent
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Aug 20, 2013
Grant Date -
Aug 13, 2009
app pub date -
Apr 9, 2009
filing date -
Dec 29, 1994
priority date (Note) -
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Abstract
A microelectronic unit can include a support structure including a dielectric having oppositely-directed first and second surfaces. A plurality of substantially rigid posts can protrude parallel to one another in a direction beyond the first surface of the support structure. Each post may have a top surface remote from the support structure, and the top surfaces can be substantially coplanar with one another. A microelectronic device having a surface with bond pads can overlie the second surface of the support structure with the bond pad-bearing surface of the microelectronic device facing toward the support structure. Connections can electrically connect the posts with the bond pads.
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