Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers
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United States of America Patent
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Aug 20, 2013
Grant Date -
Apr 22, 2010
app pub date -
Oct 19, 2009
filing date -
Oct 22, 2008
priority date (Note) -
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Abstract
A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.
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