Method for producing an integrated circuit and resulting film chip
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United States of America Patent
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Aug 13, 2013
Grant Date -
Jun 28, 2012
app pub date -
Jan 5, 2012
filing date -
Jul 6, 2009
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Abstract
A semiconductor substrate having a first lateral dimension is combined with a flexible film piece having a second lateral dimension by arranging the semiconductor substrate in a recess of the film piece. The semiconductor substrate has circuit structures produced using lithography process steps. After the semiconductor substrate has been arranged in the recess of the film piece, a patterned layer of an electrically conductive material is produced above the semiconductor substrate and the film piece using lithography process steps. The patterned layer extends from the semiconductor substrate up to the flexible film piece and forms a number of electrically conductive contact tracks between the semiconductor substrate and the film piece.
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