Profile based laser cutting within a high-speed transport device
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United States of America Patent
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Aug 13, 2013
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app pub date -
Mar 18, 2009
filing date -
Mar 18, 2009
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Abstract
The present application relates to a method and system thereof for performing laser cutting on a mail piece during processing on a document processing device such as a sorter. Laser cutting is performed to effectively cut mail pieces during transport on the document processing equipment to ensure cut accuracy and to promote readability. The present teachings allow for selection of a cut profile based on mail piece attributes or markings and adaptive adjustment of the cut profile in accord with the positioning of the mail piece to achieve a desired cut pattern while the document processing device is running at high transport speed.
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