Seamless capsule manufacturing apparatus
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United States of America Patent
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Aug 13, 2013
Grant Date -
Sep 1, 2011
app pub date -
Oct 9, 2009
filing date -
Oct 20, 2008
priority date (Note) -
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Abstract
A liquid coolant supply pipe and an over flow pipe are provided on the outer side of a capsule forming pipe through which a liquid coolant flows and into which liquid droplets are dropped from a nozzle. The liquid coolant is supplied to the liquid coolant supply pipe by a low pulsatory motion type pump, and the flow is regulated by a flow straightening block in the liquid coolant supply pipe. The cooling liquid passes through a liquid coolant introducing section having a curved surface, and then flows into the capsule forming pipe from an upper portion opening in a cap mounted to the upper part of the capsule forming pipe. The liquid coolant flows into the capsule forming pipe, and the excess flows into the overflow pipe.
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