Methods of inspecting and manufacturing semiconductor wafers
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United States of America Patent
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Aug 6, 2013
Grant Date -
Nov 1, 2012
app pub date -
Apr 26, 2012
filing date -
Apr 28, 2011
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Abstract
A method of manufacturing a plurality of semiconductor wafers comprising micro-inspecting at least one location within at least one micro-inspected pattern field and determining at least one parameter value representing a property of the wafer at the micro-inspected location, macro-inspecting a plurality of locations within the at least one micro-inspected pattern field and determining, for each macro-inspected location of the macro-inspected pattern field, at least one parameter value representing the property of the wafer at the macro-inspected location based on the light intensity recorded for the macro-inspected location and on the at least one parameter value representing the property of the wafer at the micro-inspected location of this pattern field.
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